PRINTED CIRCUITS BOARDS - PCB PRODUCTION

Experience and reliability enable our organisation to meet the needs of an increasingly demanding clientele, making us the ideal commercial partner for leading firms in any sector. Part of our production line is dedicated to the quick sampling service. An increasingly important need for the customer and an increasingly targeted and professional service on our part.

Single-Layer

  • CEM1
  • FR4
  • POLYIMIDE / KAPTON
  • THERMALCLAD

Double-Layer

  • FR4 STANDARD
  • FR4 HIGH Tg
  • TEFLON
  • POLYIMIDE / KAPTON

Multi-Layer

  • FR4 STANDARD
  • FR4 HIGH Tg

Aluminum

  • Copper circuits one side, 35µ to 140µ
  • With a 150µ dielectric bonded to an Aluminum or Copper base 1.02/1.57/2.03/3.18mm thick

SPECIFICATIONS

Proproperty Values
Finiture Finali Hot Air Levelling ( HAL ), Hot Air Levelling Lead Free, Oro Chimico, Stagno Chimico, Oro Elettrolitico, Rame Passivato
Specifiche Finali Approvazioni : UL 94VO, UNI EN ISO 9001:2008, Schede ispezionate con IPC-A-600H
Spessore e distanza minima 80µ/.003
Diametro minimo di foratura 0.1mm/.004
Tipo di Foratura Micro Via, Blind Via, Buried Via, Controlled Impedence
Multistrati Da 4 a 16 strati
Spessore del materiale MIN: 0.6mm/.023, MAX: 3.2mm/.125
Spessore del rame Outer Layer – 135µ, Inner Layer – 105µ
Tipi di solder mask Solder Mask, Peelable Ink, Solder Resists Graphite Contacts
Colori Verde, Rosso, Blu, Nero, Bianco
Massima dimensione della scheda finita Monofaccia e Doppiafaccia : 700 x 600 mm, MultiStrato : 700 x 600 mm