| Final Finishes |
Hot Air Levelling ( HAL )
Hot Air Levelling Lead Free
Chemical Gold
Chemical Tin
Electrolitic Gold
Copper Passivated |
| Final Specifications |
Approvals : UL 94VO,
UNI EN ISO 9001:2000
Boards inspected to IPC-A-600F |
| Minimum line and distance |
80µ/.003 |
| Minimum drilled hole |
0.1mm/.004 |
| Type of drill |
Micro Via
Blind Via
Buried Via
Controlled Impedence |
| MultiLayers |
From 4 to 16 layers |
| Material Thickness |
MIN: 0.6mm/.023
MAX: 3.2mm/.125 |
| Copper Thickness |
Outer Layer - 135µ
Inner Layer - 105µ |
| Solder mask Type |
Solder Mask, Peelable Ink / Solder Resists Graphite Contacts |
| Colors |
Green, Red, Blue, Black, White |
| Maximum dimension of the finished board |
Single and DoubleSided : 670 x 550 mm
Multilayer : 671 x 550 mm |