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Final Finishes
  • Hot Air Levelling ( HAL )
  • Hot Air Levelling Lead Free
  • Chemical Gold
  • Chemical Tin
  • Electrolitic Gold
  • Copper Passivated
Final Specifications
  • Approvals : UL 94VO,
    UNI EN ISO 9001:2000
  • Boards inspected to IPC-A-600F
Minimum line and distance 80µ/.003
Minimum drilled hole 0.1mm/.004
Type of drill
  • Micro Via
  • Blind Via
  • Buried Via
  • Controlled Impedence
MultiLayers From 4 to 16 layers
Material Thickness MIN: 0.6mm/.023
MAX: 3.2mm/.125
Copper Thickness Outer Layer - 135µ
Inner Layer - 105µ
Solder mask Type Solder Mask, Peelable Ink / Solder Resists Graphite Contacts
Colors Verde, Rosso, Blu, Nero, Bianco
Maximum dimension of the finished board
  • Single and DoubleSided : 670 x 550 mm
  • Multilayer : 671 x 550 mm
MicroElettronica
Vicenza 2007
15.03.2007 - 17.03.2007
Pad.G / Stand 1798 - 1799
  Company
  Production
   Introduction
   Material Types
   Specifications
   Machinery Park/Processes
   Technical Department
   Drilling
   Metallizzation
   Yellow Room
   Galvanic Line
   MultiLayer processing
   Silk-Screen
   Mechanical finishes
   Electrical Test
  Quality
  Environment
  Where we are
   
  Contacts
  Inquiry
  Intranet
  References
   
   
   
Web-Mail
36031 Dueville [Vicenza] Italy - Via Tre Scalini,64 - Tel. 0039.0444.945001 - Fax 0039.0444.946200
P.Iva/VAT : 02428840249 - e-mail: pduesse@tin.it
Copyright EulogiKa SH 2005