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Galvanization processes are constantly kept under control through chemical analysis and specifications, both internal and external analysis.

This assures to the final customer product the quality of the many components that made up a PCB.

Moreover final tests on the copper thickness of the PCB are performed through measure systems with high precision (MRX) and metallographical samples with the option of execute high definition photos.
MicroElettronica
Vicenza 2007
15.03.2007 - 17.03.2007
Pad.G / Stand 1798 - 1799
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36031 Dueville [Vicenza] Italy - Via Tre Scalini,64 - Tel. 0039.0444.945001 - Fax 0039.0444.946200
P.Iva/VAT : 02428840249 - e-mail: pduesse@tin.it
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