PRINTED CIRCUITS BOARDS - PCB PRODUCTION
Experience and reliability enable our organisation to meet the needs of an increasingly demanding clientele, making us the ideal commercial partner for leading firms in any sector. Part of our production line is dedicated to the quick sampling service. An increasingly important need for the customer and an increasingly targeted and professional service on our part.
Single-Layer
- CEM1
- FR4
- POLYIMIDE / KAPTON
- THERMALCLAD
Double-Layer
- FR4 STANDARD
- FR4 HIGH Tg
- TEFLON
- POLYIMIDE / KAPTON
Multi-Layer
- FR4 STANDARD
- FR4 HIGH Tg
Aluminum
- Copper circuits one side, 35µ to 140µ
- With a 150µ dielectric bonded to an Aluminum or Copper base 1.02/1.57/2.03/3.18mm thick
SPECIFICATIONS
| Property | Values |
|---|---|
| Finishing | Hot Air Levelling ( HAL ), Hot Air Levelling Lead Free, Chemical Gold, Chemical Tin, Electrolytic Gold, Passivated Copper |
| Final Specifications | Approval : UL 94VO, UNI EN ISO 9001:2015, Cards inspected with IPC-A-600H |
| Thickness and minimum distance | 80µ/.003 |
| Minimum diameter of drilling | 0.1mm/.004 |
| Type of drilling | Micro Via, Blind Via, Buried Via, Controlled Impedence |
| Multilayer | From 4 to 16 layers |
| Thickness of the material | MIN: 0.6mm/.023, MAX: 3.2mm/.125 |
| Thickness of copper | Outer Layer – 135µ, Inner Layer – 105µ |
| Types of solder mask | Solder Mask, Peelable Ink, Solder Resists Graphite Contacts |
| Colors | Green, Red, Blue, Black, White |
| Maximum size of the finished board | SingleFace or DoubleFace : 700 x 600 mm, Multilayer : 700 x 600 mm |