|
Layers max
|
12
|
|
Max circuit measurement
|
700x600
|
|
Circuit thickness
|
max. 4.5 min. 0.30
|
|
Basic copper
|
18µ 35µ 70µ 105µ 140µ
|
|
Material
|
FR4 ( TG 135 TG 150 TG170 )
|
|
Surface finish
|
HAL lead free , chemical gold / electrolytic,
|
|
Minimum hole
|
0.15mm
|
|
Conductor min. and isolation min.
|
100/100 µ
|
|
Aspect Ratio ( hole diameter : thickness pcb )
|
1:10
|
|
Additional prints
|
Silkscreen printing
Print coverage vias
Peelable print
Graphite print
|
|
HAL
|
lead free 1 → 40 µn 12 months (vacuum packing) process temperatures: 260°-275°
|
|
Chemical gold / electrolytic
|
lead free 0.1 → ± 0.025 12 months (vacuum packing) process temperatures: 70°
|
